| ASCEN technology co.,ltd |
LCD Screen ACF Bonding Hot Bar Soldering Machine With CCD Camera
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| Usage: | Hot Bar Soldering | Temperature Precision: | ±2°C |
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| Dimension: | 430*185*220 | Bonding Circle: | 7s |
| Warranty: | One Year | Force Head Pressure: | 0.1-0.6 MPa |
Hot Bar Soldering Machine For LCD Screen ACF Bonding With CCD Camera
About Hot Bar Bonding Machine Introduction
hot bar soldering machine also named pulse heat unit/hot bar bonding machine/reflow soldering machine/heat pressure machine/thermo-compression machine is intended to solder electric components.
It consists of a reflow head which holds down the object and applies pressure force and the pulse heat power supply which applies the current.
Pulse heating is an instantaneous heating method. Heating is performed only when the solder is desired to be melted.
Electric current is applied to the iron to generate heat by resistance and the solder is melted. When the solder has melted, the current will be stopped and the solder is cooled. And when the solder has hardened, the heater tip is raised.
Because the pressure is kept applied until the solder is hardened, highly reliable joining without lifting up can be achieved.
ACF Bonding Macine Details
- IGBT inverter with 4kHz frequency.
- Temperature closed loop control, feed back every 0.25ms.
- Real time display temperature curve.
- Upper and lower monitor of the temperature.
- Easily operating.
- Overheat protection, overvoltage/undervoltage protection.
- High precisely heating control system.
- Two steps heating with upslope.
- Ease for automation.
- Saving power, 50% off than traditional AC soldering power.
