ASCEN technology co.,ltd

TAB COF ACF LCD Bonding Machine For LCD TV Screen Laptop Panel Repair

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Description
Repair Type: Laptop Panel Repair Bonder: Pulse Heat Bonding
TAB Repair: LCD Bonding Machine Application: 100 Inch TV
Color: Grey Weight: 340 Kg

 

 

 

TAB COF ACF LCD Bonding Machine For LCD TV Screen Repair Laptop Panel Repair

 

 

LCD TV Screen Repair Machine Technical Parameters

 

Supply Pressure 0.5~0.7Mpa (Dry air source)
Power Supply AC 220V±10%,50HZ,1200W
Cylinder Device SMC original thin cylinder
Pressure System Pressure system parallel bars structure can eliminates Indenter own weight, the pressure minimum accuracy to 0.1 KG , pressure part both are use SMC precision components
Heating Type Pulse (rapid heating / cooling and auxiliary cooling function)
PID Temperature Control System Branded:Adjustable heating curve Precision PID self-tuning type
The peak temperature : within +/- 2 degrees Celsius Room temperature time to 180 degrees the response time within 2-3 seconds
Hot pressing head Materials: Titanium
origin: United States 45*1.4*10
Plane precision (hot press side) :0.001mm
Plane thickness 0.5 (Reserved 3 times grinding)
Thermocouple Type K type OMEGA wire

 

What is the pulse hot-pressing machine?
 

1, The popular explanation:

Pulsed hot pressing machine is by hot pressing head loading pulse voltage, hot head heating , will be connected to the object, when the temperature rises to solder melting point after (i.e., after the rise to the predetermined temperature), will be connected to the tin melting between the objects and put it together.Applied to mobile phone manufacturer, touch screen manufacturers, such as computer, printer manufacturers, production technology applied in the following products: USB wire welding, soft wire FFC flexible PCB FPC or rigid circuit board PCB welding, TCP and circuit board PCB or PCB FPC welding between soft,welding?flexible circuit board FPC between circuit board PCB , etc.

 

2, Professional explanation:

Pulse hot press is the English translation of Pulse hot press, by hot pressing head loading Pulse voltage, ?hot head heating , will be connected to this object to heat up, when the temperature rises to soldering tin melting point (i.e., to simulate the temperature after), will be connected to the tin melting between the objects and connect it together. The general Pulse hot-press temperature closed loop control.

 

 

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