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The surprised SMT solution
ASCEN provide OEM serve and producting standard /customized automatic assembly equipment,specialize in PCB conveyor,PCB depaneling machine,PCB router,SMT component feeder,PCB loader unloader and so on
 

​FPC to PCB Board Pulse-Heated Soldering Machine / Welding Machine with Pulse Heat

Detailed Product Description

ASCEN technology team is escorted by a vigorous team of humble and patient staff. They enjoy listening to the clients and tailoring automatic assembly solutions up to clients' demand. we dedicated to making quality machine that help our clients operate more efficiently and effectively.If you interested in our complete equipment solution,please go to our engineering web: www.ascen.ltd




Name: Hot Bar Welding Machine Temperature Precision: ±2°C
Color: White Bonding Circle: 7s
Working Area: 200mm×260mm Pressure: 0.5-0.7Mpa

    ​FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse Heat  

Description:

 

Hot bar soldering is extremely effective in bonding components and parts

that are dissimilar and difficult to unite. Several examples are listed above,

but there are many other soldering situations that call hot bar reflow soldering

system. This technology, also known as pulse bonding, differs from traditional

soldering since the reflow process uses thermode technology, which is based

on rapid reflow by pulse heating. This procedure allows materials with low

temperature resistance to be soldered at high lead-free temperatures without

damage to the flex. It selectively solders parts by heating them to a temperature

that's high enough to cause their adhesive or solder to melt and then re-solidify

to form a permanent bond.

 

​FPC to PCB Board Pulse-Heated Soldering Machine / Welding Machine with Pulse Heat

 

Features:   FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine
1.Extremely short cycle time with rotary table design. Product loading and

unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer along

the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with micrometer

alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor and

illumination for fine pitch application.
10.Full microprocessor logic control.

ASCEN technology co.,ltd specializing in the SMT automatic equipment and provide the automatic solution for the smart factory for save more producing cost.

Contact Details

Whether you'd like to get more info on what,why and how we do what we do, need help with what you're creating,would line to partner up or just say hi!

—--- We'd love to hear from you.

Tel/Whatsapp:13377777085

Email:info@ascen.ltd

Skype:supplier889

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